Advanced Automated Coating Solution for Organic Solderability Preservatives
PCB OSP Surface Finish Machine
Features:PCB OSP Surface Finish Machine is replaced process of single plate post treatment and leveling of multi-layer plate.It is widely used for the formulation of liquid chemical medicine.which forms a protective film for the copper surface. it is brand new and environment-friendly equipment with good quality of anti-oxidation and weldability.
Our PCB OSP Surface Finish Machine revolutionizes copper protection in printed circuit board manufacturing. This fully automated system replaces traditional single-plate post-treatment methods with an integrated organic solderability preservatives (OSP) coating process. Engineered for modern PCB production lines, it creates a uniform protective film on copper surfaces that delivers exceptional anti-oxidation properties and superior weldability.
Ideal for high-volume manufacturing, this environmentally-friendly solution ensures consistent OSP application for both single-layer and multi-layer PCBs. The automated process flow minimizes human intervention while maximizing throughput quality - critical for applications requiring reliable solder joints in consumer electronics, automotive systems, and industrial control boards.
PCB Anti-oxidation Machine Process flow: Feeding → Chemical washing → Recycle Water Washing1/2 → Running Water Washing → Micro etching → Washing by pump → Acid washing → Recycle water washing3/4 → DI washing → Bkot up → Anti-oxidation → Blot drying → Recycle water washing 5/6/7 → DI washing → Blot up → Cold wind drying → Hot wind drying → Discharge
Model: GE-OSP650
Working width: 650mm
PSize of Machine:L14535*W1600*H1980
Working Height:900mm
Wheelbase :35mm
Running Speed:0.5-5m/min
Power voltage:380V 50HZ three-phase
Total power of the machine :50 KW
Size of minimal board:Min 120*80mm
Thickness of outputing board:0.4-3mm
Running water consuming:24-36L/min
PCB OSP Surface Finish Machines apply organic solderability preservatives through automated chemical processing to create protective anti-oxidation coatings on copper circuits. This environmentally friendly solution enhances solderability while preventing copper oxidation during PCB storage and assembly operations.
Key Features of PCB OSP Surface Finish Machines:
Our advanced OSP coating systems integrate precision chemical management with automated conveyor processing to deliver uniform protective films. Key features include:
Multi-Stage Chemical Processing System:
14-stage automated treatment including micro-etching, acid activation, and dual DI rinsing for optimal copper surface preparation
Precision OSP Application: Controlled immersion coating forms 0.2-0.5μm uniform organic film for superior solderability preservation
