Industrial Drying Systems for Electronics Manufacturing
Advanced drying equipment utilizes precision thermal control to cure coatings and stabilize materials across PCB production and metal processing. Core technologies include:
Hot Air Convection Systems
Operating Principle: Forced air circulation ensures ±5℃ temperature uniformity, critical for preventing warpage in metal sheets and multilayer PCBs during curing.
Key Applications:
Bulk curing of epoxy-based solder masks at 120±5℃ profiles Text ink solidification on PCBs and decorative metal surfaces Pre-lamination baking of copper-clad laminates to mitigate material expansion
Far-Infrared Radiant Systems
Operating Principle: Direct electromagnetic energy transfer penetrates substrates, reducing energy consumption by 30% versus conventional methods while enabling micron-level precision.
Key Applications:
Rapid curing of UV-sensitive LED encapsulation materials， Single-side photoresist patterning on surgical tools and aerospace components， High-resolution drying for flexible PCB coatings requiring specific wavelength control
Key Technical Notes:
- Hybrid Tunnel Efficiency Combines infrared rapid heating (energy reduction ≥30%) and hot air uniformity (±3°C tolerance) for solder mask curing.
- micro-aperture Integrity: Double-sided metal drying requires synchronized thermal control to prevent aperture deformation (>50µm precision).
- Artwork Reliability: Decorative metal ovens must avoid temperature spikes (>5°C/min ramp rate) to preserve etching details4.
- Ink Adhesion: Legend inks demand zoned cooling gradients (≥10°C/min reduction) to eliminate micro-cracking.