GE-1300 UV-Curable Yellowing-Resistant LED White Ink

What Is It?

GE-1300 is Golden Eagle's own UV-curable yellowing-resistant white ink for LED PCB and reflective solder-mask applications. Unlike a thermal-cure white ink, GE-1300 hardens in seconds under a UV lamp, which means a much shorter cycle time and no oven bottleneck on the production line.

The cured film has a 4H pencil hardness, full resistance to alcohol, acid, alkali, gasoline and solvent, and survives 50 wipes with a salt-water-soaked cotton ball at 300 g pressure. The mesh never blocks, which means consistent print quality across a long production run. The standard colour is white, but GE-1300 is also available in yellow, red, blue, black and green on request.

Key Features

• UV cure, never-blocking mesh. 2.0 kW/cm lamp, 3–4 lamps, 2.5–3.5 m/min belt speed, 1200–1800 mJ/cm². The film hardens in one pass; the mesh does not block during a long print run.
• 100–140T (250–350 mesh) screen print. Fine mesh for fine detail. The cured film is 12–16 µm thick, which gives high resolution without losing the white reflectivity.
• 4H pencil hardness. Hard enough to survive assembly, rework and in-field handling. Pencil test at 500 g force, 500+ wipes with no loss of adhesion.
• Full chemical resistance. Alcohol, acid, alkali, gasoline, solvent. 500 g force, 500+ wipes. 3M tape cross-hatch: no lift. Salt water resistance: 50 wipes at 300 g pressure.
• Coverage up to 36 m²/kg. With appropriate dilution and screen equipment, a single kilogram covers up to 36 square metres. One of the most economical white inks in its class.
• Multiple colours on request. White is standard. Yellow, red, blue, black and green are available for non-white solder-mask or decorative applications.

Process Flow

The full sequence from substrate to finished part. Exact temperatures and times depend on the application; full details are in the operating parameters table below.

Technical Specifications

Operating Parameters — Step by Step

1. Substrate preparation. Clean and degrease the substrate. GE-1300 bonds well to bare, plated, painted and powder-coated metal as well as to glass. Ensure the surface is dry and dust-free before printing.
2. Ink preparation. Stir thoroughly before use. Dilute with the supplier's recommended UV thinner only — a generic thinner can inhibit UV cure and leave a tacky surface.
3. Screen printing. Use a 100–140T (250–350 mesh) polyester screen. Print a single wet pass. The wet film should be glossy and fully covered; the cured film will be 12–16 µm thick.
4. UV cure. Pass the panel under a 2.0 kW/cm medium-pressure mercury lamp (3–4 lamps) at 2.5–3.5 m/min. UV dose should be 1200–1800 mJ/cm². The film is fully cured when it is hard and glossy to the touch.
5. Quality check. Check adhesion with 3M tape cross-hatch. Check hardness with a 4H pencil. Check chemical resistance with a 500 g wipe test if required.
6. Re-cure if needed. If the film is under-cured (tacky surface, poor adhesion), reduce the belt speed or add a second UV pass. Do not over-cure, which can cause yellowing.

Typical Applications

• LED FR4 PCBs (single and double sided)
• Aluminium LED PCBs
• White reflective solder mask on lighting modules
• COB (chip-on-board) LED substrates
• Backlight panels and edge-lit LED strips
• Decorative metal nameplates and signage
• Glass instrument dials and decorative panels

Storage and Safety

• UV safety. UV lamps emit dangerous UV-C and UV-B. Operators must wear UV-blocking face shields and long-sleeved clothing. Interlocks on the lamp housing must be operational.
• Storage. Sealed, in a dry place, away from strong light. Shelf life 1 year. Avoid contact with strong acids and bases.
• Ink preparation. Stir thoroughly before use. Dilute only with the supplier's UV thinner.
• Ventilation. UV cure should be vented to outside air. The cured film is inert.
• Disposal. Cured scrap can be disposed of as non-hazardous industrial waste. Uncured ink should be treated as chemical waste and disposed of through a licensed contractor.

Quality Inspection

Each batch is checked on a production test panel before it ships. Below: typical adhesion, exposure and development results on PCB and metal substrates.