PCB Etching Equipment and Wet processing equipment and Chemical Milling machine and Metal etchers


Manually Electroless Copper Plating machine for Small scale production


Electroless Copper Plating machine for Small scale production

Features:Plated through hole is also called electroless plating copper, and PTH is for short. And plated through hole is an autocatalytic oxidation-reduction reactions, depositing on the non-conductive substrate, it can't be denied that plated through hole plays a role in bonding between the layers in double-sided board and multilayer board. And plated through hole is used for the ceramic copper plating, resin copper plating, diamond copper plating and so on. It will do the plated through hole process after drilling for two layers or multilayer board. Plated-Through-Hole plating equipments is copper plating equipments for PCB PTH uses. The size can be order as your copper plating processing needs.

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Process flow for PTH line: Tank 1: Cleaning: 32 liters, To to 55°C  →  Tank 2: Washing water: 32 liters  →  Tank 3: Axit Cleaning: 16 liters  →  Tank 4: Washing water: 32 liters   →  Tank 5: Micro Etching: 16 liters   → Tank 6: Washing water: 32 liters  →  Tank 7: Pre-Plating: 16 liters  →  Tank 8: Activation: 16 liters →  Tank 9: Washing water: 32 liters  →  Tank 10: Acceleration: 16liters →  Tank 11: Washing water: 32 liters  →  Tank 12: Electroless Copper: 16 liters  →  Tank 13: Washing water: 32 liters → Tank 14: Sunfur Axit : 16 liters →  Tank 15: Copper plating: 45 liters →  Tank 16: Copper plating: 45 liters Tank → 17: Atinox: 16 liters → Tank 18: Over flow washing: 32 liters

Main technical parameter:
1.Dimensions ： 4900*1200*800mm
2.microfilter： 1H/50L 5um
3.heater ： 3kw*9sets
4.power ： 12V/160A-2set（Containing anode and cathode plate ）
5.Swing motor ： 0.2KW/1 set
6.Vibration motor ： 60W*4 sets
7.One air inlet pipe, one water inlet pipe and one pure water inlet pipe respectively
8.AIR Exhaust / exhaust 1 set
9.Pneumatic stirring： 5.5KW/set
10.power： 380V/50HZ-42kw

The process and size of this PTH equipment can be customized according to customer requirements



Manually Copper ElectroPlating machine for Small scale production


Manually Copper ElectroPlating machine for Small scale production
Process flow for Copper electroplating line: 1 Micro Etching → →2 Washing water→ 3 Sunfur Axit→ 4 Washing water→ 5 Copper plating→ 6 Copper plating→ 7 Washing water→ 8 Plating tin: → 9 Over flow washing

Main technical parameter:
1.Dimensions ： 2800*1200*800mm
2.microfilter： 1H/50L 5um
3.heater ： 3kw*5sets
4.power ： 12V/160A-3set（Containing anode and cathode plate ）
5.Swing motor ： 0.2KW/1 set
6.Vibration motor ： 60W*4 sets
7.One air inlet pipe, one water inlet pipe and one pure water inlet pipe respectively
8.AIR Exhaust / exhaust 1 set
9.Pneumatic stirring： 5.5KW/set
10.power： 380V/50HZ-42kw

The process and size of this Copper electroplating can be customized according to customer requirements

PTH MACHINE for Laboratory use

Small size PTH MACHINE for Laboratory use

  • Small size PTH MACHINE for Laboratory use
  • Model:GE-CT300
  • Maximum machining size: 250× 300mm
  • Minimum via aperture:0.2mm
  • Plating tank volume :25L
  • Out size:1200*950*1200mm
  • double sided through-hole copper sinking for non-metallic materials such as double-sided and multi-sided circuit boards
small size Electro copper plating machine

small size Electro copper plating machine

  • small size Electro copper plating machine
  • Model:GE-DT300
  • Maximum machining size: 250× 300mm
  • Plating tank volume :25L
  • Power:AC220V /50Hz
  • Out size:1200*950*1200mm
  • This small copper plating machine is used for thickening after the completion of the electroless copper plating
automatic tin plating machine small size for Laboratory school

automatic tin plating machine small size for Laboratory school

Electroless Copper Plating machine for Small scale production

Manual Electroless Copper Plating machine for Small scale production

  • Manual Electroless Copper Plating machine for Small scale production
  • Tank 1: Cleaning: 32 liters, To to 55°C  →  Tank 2: Washing water: 32 liters  →  Tank 3: Axit Cleaning: 16 liters  →  Tank 4: Washing water: 32 liters   →  Tank 5: Micro Etching: 16 liters   → Tank 6: Washing water: 32 liters  →  Tank 7: Pre-Plating: 16 liters  →  Tank 8: Activation: 16 liters →  Tank 9: Washing water: 32 liters  →  Tank 10: Acceleration: 16liters →  Tank 11: Washing water: 32 liters  →  Tank 12: Electroless Copper: 16 liters  →  Tank 13: Washing water: 32 liters → Tank 14: Sunfur Axit : 16 liters →  Tank 15: Copper plating: 45 liters →  Tank 16: Copper plating: 45 liters Tank → 17: Atinox: 16 liters → Tank 18: Over flow washing: 32 liters
Plated through hole(PTH) machine

Plated through hole(PTH) machine

  • Semi-automatic Plated through hole(PTH) machine
  • Process flow: Deburring → alkaline degreasing → secondary or tertiary countercurrent rinsing → roughening (micro erosion) → secondary countercurrent rinsing → pre leaching → activation → secondary countercurrent rinsing → degumming → secondary countercurrent rinsing → PTH → secondary countercurrent rinsing → pickling
  • It will do the plated through hole process after drilling for two layers or multilayer board. The process and size of this PTH equipment can be customized according to customer requirements.
Manually Nickel and Copper Plating Production Line

Manually Nickel and Copper Plating Production Line

  • Manually Nickel and Copper Plating Production Line
  • Model： GE-NC650
  • size of machine : L13580*W1800*H1980mm
  • production capacity :1500-2000㎡
  • size of maximal board:850mm*650mm
  • Volume of plating tank：L1150*W350*H900mm
  • The Manually nickel and copper plating production line is for PCB & FPC industry.
Electroless nickel immersion gold (ENIG) plating machine for PCB

Electroless nickel immersion gold (ENIG) plating machine for PCB

  • Electroless nickel immersion gold (ENIG) plating machine for PCB
  • Model： GE-NG650
  • Ultrasonic degreasing → hot water washing → water washing → degreasing → hot water washing → water washing 1 → water washing 2 → micro-etching → water washing → activation → water washing 1 → water washing 2 → water washing 3 → pure water washing → nickel plating 1 → nickel plating 2 → recycling → Water washing 1 → Water washing 2 → Water washing 3 → Gold plating → Recycling → Water washing 1 → Water washing 2 → Water washing 3 → Gold plating → Recycling → Water washing 1 → Water washing 2 → Water washing 3 → Protection → Water washing 1 → Water washing 2 → Hot water washing
Fume hoods electro plating station

Fume hoods electro plating station Laboratory use

  • Fume hoods electro plating station Laboratory use
  • Model： GE-FHEP650
  • working process:loading--electro plating--water rinsing--unloading
  •  All fume hoods are designed, manufactured and installed in accordance with international standards, both in size, shape, function and technology to meet different chemical, biological, and pharmaceutical laboratory requirements..