Industrial PTH Line for electroless copper plating of multilayer PCBs. Features automated chemical control, 3000-5000m²/month capacity, and customizable configurations for reliable via metallization.
Plated Through Hole (PTH) Line for PCB Copper Plating
featuring customizable processing chambers and automated chemical management for reliable hole metallization
Plated-Through-Hole (PTH)Line
Features:Plated through hole is also called electroless plating copper, and PTH is for short. And plated through hole is an autocatalytic oxidation-reduction reactions, depositing on the non-conductive substrate, it can't be denied that plated through hole plays a role in bonding between the layers in double-sided board and multilayer board. And plated through hole is used for the ceramic copper plating, resin copper plating, diamond copper plating and so on. It will do the plated through hole process after drilling for two layers or multilayer board. Plated-Through-Hole plating equipments is copper plating equipments for PCB PTH uses. The size can be order as your copper plating processing needs.
Model :PTH600
Power:57KW/380V/50HZ
Tank size:W300*H700*L600mm
Tank material:12mmPP + 15mPP
Heater Material:Titanium,3KW/pc
Rectifier:6V,100A
Filter:5um and 10um
Automatic Control System:
Times control system;
Temperature control system;
Auto Air mixture system;
Network filter system;
Production Capacity:3000~5000 square meter per month
PTH line working video
Plated-Through-Hole (PTH)Line
Features:Plated through hole is also called electroless plating copper, and PTH is for short. And plated through hole is an autocatalytic oxidation-reduction reactions, depositing on the non-conductive substrate, it can't be denied that plated through hole plays a role in bonding between the layers in double-sided board and multilayer board. And plated through hole is used for the ceramic copper plating, resin copper plating, diamond copper plating and so on. It will do the plated through hole process after drilling for two layers or multilayer board. Plated-Through-Hole plating equipments is copper plating equipments for PCB PTH uses. The size can be order as your copper plating processing needs.
Model :PTH600
Power:57KW/380V/50HZ
Tank size:W300*H700*L600mm
Tank material:12mmPP + 15mPP
Heater Material:Titanium,3KW/pc
Rectifier:6V,100A
Filter:5um and 10um
Automatic Control System:
Times control system;
Temperature control system;
Auto Air mixture system;
Network filter system;
Production Capacity:3000~5000 square meter per month
PTH line working video
Applications
PCB Manufacturing
Ideal for solder mask application in high-density interconnect (HDI) PCBs
Fine-Line Circuits
Perfect for creating precise circuit patterns down to 2.0mil resolution
Multilayer Boards
Ensures perfect layer-to-layer registration for complex multilayer designs
It will do the plated through hole process after drilling for two layers or multilayer board. The process and size of this PTH equipment can be customized according to customer requirements.
working process:loading--electro plating--water rinsing--unloading
All fume hoods are designed, manufactured and installed in accordance with international standards, both in size, shape, function and technology to meet different chemical, biological, and pharmaceutical laboratory requirements.
Fume hoods electro plating station Laboratory use.
Professional PCB Plating Solutions | Electroless Copper Plating Machines, Copper Electroplating Equipment & Tin Plating Systems
Advanced plating systems form the critical foundation for reliable PCB conductivity and solderability, enabling precise metallic layer deposition through chemical and electrochemical processes. These automated solutions deliver micron-level uniformity for hole wall coverage, surface finishes, and circuit formation across rigid, flex, and HDI boards serving automotive, aerospace, and 5G communication industries.
Key Features of Modern Plating Systems:
Multi-Stage Process Control: Integrated tanks for degreasing, activation, acceleration, and plating with real-time chemical parameter monitoring
Pulse Reverse Electroplating: Precision copper deposition with optimized throwing power for high-aspect ratio vias (>15:1)
Selective Plating Technology: Programmable anode arrays and masking for zone-specific deposition thickness control (±0.1μm)
Automated Chemical Management: Closed-loop dosing systems maintaining bath composition within 5% tolerance
Environmental Compliance: Zero-discharge rinse water recycling and effluent treatment systems
Smart Analytics Integration: IoT-enabled performance tracking with predictive maintenance alerts
Applications in PCB Manufacturing:
Electroless Copper Deposition: Create uniform conductive layers (0.3-5μm) on non-conductive substrates for through-hole metallization prior to electroplating, ensuring reliable hole wall connectivity in multilayer boards.
Copper Electroplating Systems: Build conductive traces and increase copper thickness (up to 100μm) with superior throwing power for high-frequency circuits, supporting controlled impedance requirements in 5G/RF applications.
Solderable Tin Finishing: Apply oxidation-resistant tin coatings (3-15μm) as final surface finish for component soldering, enabling high-reliability interconnections in automotive control modules.
HDI Microvia Metallization: Achieve uniform copper deposition in laser-drilled microvias (<100μm diameter) through optimized agitation and pulse plating for next-generation wearable electronics.
Custom Plating Solutions: Tailored configurations for specialty applications including thick-copper power boards (400+ μm), reel-to-reel flex circuit plating, and embedded component encapsulation.
_machine.jpg "Plated Through Hole(PTH)line for PCB")
_plating_machine_for_PCB.jpg "Electroless nickel immersion gold (ENIG) plating machine for PCB")
