GE-XY650 · 650mm Working Width · CE Certified

GE-XY650 Photoresist Developing Cleaning Drying Machine

Three-in-one photoresist & solder mask developing line. 650mm working width, double-spray with oscillation, sodium carbonate chemistry 1–5%, integrated cascade rinse, 35–45°C . Suits 20–500 m²/day double-side PCB production.

CE Certified 24h Quotation 1-Year Warranty Worldwide Delivery
GE-XY650 photoresist developing cleaning drying machine
⚡ Quick Answer

The GE-XY650 is a 650mm photoresist and solder mask developing cleaning drying machine for PCB inner-layer, outer-layer, and solder mask imaging. It combines developing (Na2CO3 1–5% at 35–45°C, double-spray with oscillation), cascade rinse (35–45°C double-spray), and drying in a single conveyor. suitable for 20–500 m²/day double-side PCB production. Beijing Golden Eagle ships worldwide with CE certification and on-site installation support.

Product Specifications

GE-XY650 Photoresist Developing Cleaning Drying Machine

Three-in-one developing line for 20–500 m²/day PCB production

The GE-XY650 photoresist developing cleaning drying machine is a 650mm working-width conveyor system that performs developing, cascade rinse, and drying in a single line. It uses sodium carbonate (Na2CO3) chemistry at 1–5% concentration to dissolve unexposed dry-film or liquid solder-mask photoresist after exposure. The double-spray with oscillation design prevents streaking and delivers uniform developing across the panel, suitable for inner-layer, outer-layer, and solder-mask imaging on FR4 PCB panels up to 21" × 24" (533 × 610 mm).

  • Model: GE-XY650
  • Power: 20 kW / 380V / 50Hz
  • Working width: 650 mm
  • Chemistry: Sodium carbonate (Na2CO3) 1–5%
  • Solution temperature: 35 ± 2 °C
  • Conductivity: 15 ± 2 mS
  • Developing pump: 4 kW, 1 set, double-spray with oscillation
  • Cascade rinse pump: 2.2 kW, 1 set, double-spray, 35–45 °C
  • Lead time: 30–60 working days

Free installation training and technical support included.

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GE-XY650 photoresist developing cleaning drying machine - production line

Technical Specifications

Detailed specifications of the GE-XY650 photoresist & solder mask developing line.

Parameter GE-XY650 Specification
ModelGE-XY650
Total Power20 kW
Power Supply380V / 50Hz / 3-phase (220V / 60Hz optional)
Working Width650 mm
Max Panel Size610 × 533 mm (24" × 21")
Min Panel Size200 × 150 mm
Developing SectionLength 1000 mm, double-spray with oscillation, 4 kW pump
HeaterTitanium pipe heater, 3 kW / unit
Working Temperature35 – 45 °C
Solution ConcentrationNa2CO3 1% – 5%
Solution Conductivity15 ± 2 mS
Solution Temperature Stability35 ± 2 °C
Cascade Rinse SectionLength 1700 mm, double-spray, 2.2 kW pump
Rinse Working Temperature35 – 45 °C
Drying SectionHot-air drying, integrated
Conveyor Speed0.5 – 4 m/min (adjustable)
Production Capacity20 – 500 m² / day (double-side)
Compatible ChemistryDry-film photoresist, liquid solder mask, Na2CO3 developer
Material of ConstructionPP / PVDF spray bars, titanium heater, SUS304 frame
Control SystemPLC + HMI touchscreen, automatic temperature & conductivity control
Lead Time30 – 60 working days
Warranty12 months from installation or 15 months from shipment

Why Choose the GE-XY650?

Three-in-one developing, rinsing, and drying in a single 650mm conveyor — saves floor space, labour, and chemistry cost.

Double-Spray with Oscillation

Developing chamber uses a top-and-bottom double-spray system with oscillation. Eliminates streaking and delivers uniform developing across the full 650mm panel width. Suitable for fine-line inner-layer imaging down to 50 μm line/space.

Sodium Carbonate Chemistry

Standard Na2CO3 developer at 1–5% concentration, conductivity 15 ± 2 mS, temperature 35 ± 2 °C. Compatible with both dry-film photoresist (inner/outer layer) and liquid solder mask. Easy wastewater treatment (pH neutralization).

Integrated Cascade Rinse

1700mm cascade rinse section with 2.2 kW double-spray pump. Counter-current water flow reduces DI water consumption by 30% compared to single-stage rinse. Automatic water level control maintains consistent rinse quality.

Automatic Temperature Control

Titanium-pipe heater (3 kW) maintains developing solution at 35 ± 2 °C. PLC monitors and adjusts temperature in real time. Eliminates over- or under-developing caused by temperature drift, improving yield by 3-5%.

20-500 m²/day Capacity

Conveyor speed 0.5–4 m/min, 20 m²/day (single panel, slow speed) to 500 m²/day (production batch, fast speed). Suitable for both R&D lab and high-volume production. Panel sizes 200×150 mm to 610×533 mm.

CE Certified & Worldwide Shipping

Optional CE certification. DDU shipping to your door. On-site installation, commissioning, and training by Golden Eagle engineers. 12-month warranty, lifetime technical support.

Complete DES Production Line

The GE-XY650 develops the developing step in a full DES (Develop-Etch-Strip) line. Pair it with Golden Eagle etching and stripping machines for a complete conveyor solution.

1. Develop

GE-XY650

This machine. Develops unexposed photoresist in Na2CO3 1–5% at 35–45 °C. Double-spray with oscillation.

2. Etch

GE-JM650 Etching Machine

FeCl3 or alkaline spray etching. Removes exposed copper. 650mm conveyor width, 25–35 μm/min etch rate. Pair with XY650 for same panel size.

3. Strip

Photoresist Stripping Machine

NaOH or KOH solution at 50–70 °C. Removes remaining photoresist after etching. 80–150 panels/hour throughput.

View Complete DES Line

Frequently Asked Questions

What is the GE-XY650 developing machine used for?

The GE-XY650 is a photoresist and solder mask developing cleaning drying machine for PCB inner layer, outer layer, and solder mask imaging. It performs developing, cascade rinse, and drying in a single conveyor line, suitable for 20-500 m²/day double-side PCB production.

What chemistry does the GE-XY650 use?

The GE-XY650 uses sodium carbonate (Na2CO3) at 1-5% concentration, conductivity 15±2 mS, and solution temperature 35±2°C. It is suitable for both dry-film photoresist and liquid solder mask developing.

What is the working width of the GE-XY650?

The GE-XY650 has a working width of 650mm. It is designed for standard PCB panel sizes up to 21" x 24" (533 x 610mm) with margin.

How is the spray system designed?

The GE-XY650 uses double-spraying with oscillation in the developing chamber (1000mm long, 4kW pump, titanium-pipe heater). The cascade rinse section is 1700mm long with 2.2kW pump and double-spraying at 35-45°C. Oscillation prevents streaking and ensures uniform developing.

What is the FOB price and delivery time?

FOB price is USD 22,800 per set (excluding CE certification USD 1,000 and DDU shipping approx. USD 7,000). Delivery time is 30-60 working days from PO. The machine is suitable for 20-500 m²/day production and the configuration can be adjusted per customer requirement.

Get a Free Quote for the GE-XY650

Tell us your PCB production volume, panel size, and target chemistry. We'll send you a tailored quotation within 24 hours.

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