Turntable spray Etching Machine_spray Etching Machine-Etching machine

What Is a Turntable Spray Etching Machine?

A turntable spray etching machine is a photoengraving system that sprays acid chemistry onto metal workpieces as they rotate on a horizontal turntable. The continuous rotation exposes every panel to fresh reagent at consistent pressure, delivering uniform etch depth across stainless steel, copper, brass and aluminium parts.

Turntable spray etching is the preferred format for mid-to-high volume decorative and signage jobs — elevator panels, nameplates, press plates, brass plaques and aluminium trim — where the through-feed of a conveyor line is overkill but flat-batch dip etching is too slow. Compared with dip tanks, turntable spray cuts cycle time by 40–60% and produces sharper edges because the chemistry is constantly replenished on the panel face.

Beijing Golden Eagle's turntable spray etching machines use fully adjustable automatic spray nozzles with single or double spray configuration. Every spray parameter — pressure, flow, nozzle angle, pattern overlap — is set from the HMI and stored in a recipe, so the same panel can be re-run identically months later. Full PLC/HMI controls cover temperature, turntable speed, spray pressure and network filter back-flush, giving operators one touchscreen to monitor the entire etch cycle.

The GE-TS650 is the standard 650×650 mm turntable. Larger turntables up to 1200×1200 mm, multi-station variants and full enclosed-fume-hood integration are available on request.

Process Flow — 8 Steps

1. Load panel — operator places blank stainless / copper / brass / aluminium sheet on the turntable fixture; recipe is selected on the HMI.
2. Pre-wet spray — DI water pre-wet ensures uniform chemistry contact across the entire panel face.
3. Main etch spray — acid chemistry (FeCl₃, CuCl₂ or customer-specific) is sprayed through adjustable nozzles at 1–3 kg pressure for the programmed duration.
4. Etch dwell — turntable continues to rotate under spray until target depth is reached (typically 30–180 seconds depending on material and etch rate).
5. Drag-out recovery — excess chemistry is blown back to tank by air-knife; recovered reagent returns to the working bath.
6. Recirculating rinse — city-water rinse spray removes residual acid from the panel surface.
7. Final DI rinse + hot-air dry — deionized water final rinse followed by heated air-knife drying leaves a spot-free surface.
8. Unload & inspect — operator removes the finished panel; turntable returns to load position ready for the next cycle.

Technical Specifications

Why Choose the GE-TS650?

• Uniform etch depth — continuous turntable rotation + multi-nozzle manifold eliminates the streaking and edge-banding common in dip-tank etching.
• 40–60% faster than dip etching — fresh reagent on every square cm of the panel face cuts total cycle time, especially on thick stainless and brass.
• Recipe-based repeatability — pressure, speed, temperature, nozzle angle and duration stored as a recipe; re-run identical jobs months later with one touch.
• Single or double spray arm — start with a single arm, retrofit the second arm in the field as throughput grows.
• Full PLC + HMI control — operators see every parameter at a glance; alarms log to the touchscreen for traceability and root-cause analysis.

Etching Samples